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hftv1108gs - tr standard product reference sheet features plcc - 6 type outline dimension 3.4 x 3.3 x 1.9mm ( l x w x h ) package product features ? wide temperature range ? high reliability for automotive exterior use ? lead - free soldering compatible ? rohs compliant ? a utomotive (car & motorcycle) exterior light source (ex. tail lamps & stop lamps) ? other : automotive interior, back light,etc . recommended applications page : 1 2017.9.29
hftv1108gs - tr unit mm weight 43mg tolerance 0.2 recommended soldering pattern outline dimensions unit mm laser marking area inside circuit top view side view bottom view page : 2 2017.9.29 sym. part name remarks qty. led die algainp 1 encapsulant silcone resin 1 lamp housing white resin 1 terminal au plating 6
hftv1108gs - tr specifications page : 3 2017.9.29 transparent and colorless algainp red product overview resin color (emitting area) die material emitting color white resin color (lamp housing) notes 1 notes 1 notes 2 tj esd operating temperature t opr forward current (ts=25 ) 2 storage temperature v item symbol maximum ratings units -40 +110 i f 5 200 ma junction temperature kv electrostatic discharge threshold "hbm" the ranges of operating and storage temperature are not applied to taping condition. esd testing method : eiaj4701/300(304) human body model (hbm) 1.5k, 100pf absolute maximum ratings 260 t stg -40 +110 125 t sld soldering temperature "reflow soldering" notes 1 notes 2 reverse voltage (ts=25 ) v r 12
hftv1108gs - tr specifications (specified as a general standard specification) page : 4 2017.9.29 39 k/w symbol item min. thermal resistance (junction - soldering point) r th(j-s) thermal characteristics typ. - 30 max. units (ta=25 ) lm v f 10 i r cd 1.90 8.0 - 7.1 i f = 140ma i v 11.2 (ta=25 ) i f = 140ma - v r = 12v - max. 2.50 symbol conditions - electro-optical characteristics typ. min. item luminous intensity 120 2.15 2 1/2 half intensity angle - units 620 forward voltage reverse current v a deg. nm - nm peak wavelength p i f = 140ma - luminous flux v i f = 140ma - 25 dominant wavelength d i f = 140ma 612 617 624 nm spectral bandwidth at 50% of i max i f = 140ma - 20 - -
hftv1108gs - tr page : 5 specifications 2017.11.13 (specified as a general standard specification) max. min. max. 1c 616 620 1d 620 624 notes measurement tolerance 1nm ta=25 i f = 140ma 1b 612 616 8.0 sorting chart for luminous intensity 7.1 leds shall be sorted out into the following chart and each rank parts shall be packed separately when shipping. 355 2e min. max. 2a 112 140 2b 140 180 2c 180 224 2d 224 280 measurement tolerance 11% 280 min. 1a 1.90 11.2 ta=25 i f = 140ma rank luminous intensity i v (mcd) condition rank forward voltage v f (v) condition max. min. max. 2.05 450 ta=25 i f = 5ma sorting chart for forward voltage rank forward voltage v f (v) condition 1d 2.35 2.50 notes measurement tolerance 0.05v 1b 2.05 1m 10.0 1l 9.0 10.0 1j min. 9.0 1k max. luminous intensity i v (cd) 8.0 rank condition notes 2f 355 2.20 2c 1.75 1.90 1c 2.20 2.35 ta=25 i f = 5ma 624 611 2b ta=25 i f = 140ma 2b 1.60 1.75 ta=25 i f = 5ma sorting chart for dominant wavelength rank dominant wavelength d (nm) condition rank dominant wavelength d (nm) condition min.
hftv1108gs - tr relative intensity vs. wavelength condition: ta = 25 , i f =140ma wavelength: (nm ) relative intensity spatial distribution condition: ta = 25 i f =140ma relative intensity: (%) technical data 0 50 100 -100 -50 0 50 100 - 30 - 60 - 90 60 30 0 90 x & y direction page : 6 2017.9.29 0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780
hftv1108gs - tr 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 50 100 150 200 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 -40 -20 0 20 40 60 80 100 forward voltage vs. forward current condition : i f =140ma forward voltage : (v ) junction temp. vs. relative forward voltage condition : i f =140ma junction temperature : tj ( ) forward current vs . relative intensity condition : ta=25 , single pulse ( tw =100 s ) forward curren : i f (ma) forward current : i f (ma ) relative intensity junction temp. vs. relative luminous flux condition : i f =140ma junction temperature : tj ( ) relative total luminous flux relative forward voltage : v f v ) technical data 0 50 100 150 200 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 page : 7 2017.9.29
hftv1108gs - tr maximum ratings of forward c urrent solder point temperature : ts ( ) junction temp. vs. relative dominant w avelength condition : i f =140ma junction temperature : tj ( ) forward current (ma ) relative dominant wavelength (nm) technical data 0 50 100 150 200 250 -40 -20 0 20 40 60 80 100 120 -10 -5 0 5 10 -40 -20 0 20 40 60 80 100 page : 8 2017.9.29
hftv1108gs - tr 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density. please do not repeat the heating process in reflow process more than twice. note 1 recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . note 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution ( acc.to eiaj - 4701/300 ) soldering condition page : 9 2017.9.29 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90~ 120sec pre - heating (soldering 230 max. peak temperature
hftv1108gs - tr 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touches the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended . the curing condition, temperature:150 max./time:120sec.max. 7. flow soldering (dip soldering) is not recommended for this product . 8. lsopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. please review the reference chart below for cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. recommended manual soldering condition temperature of iron tip 350 max. (iron tip 3 0w max.) soldering duration, time 3sec.max.,1 time soldering condition cleaning agents recommended / not recommended isopropyl alcohol ? recommended trichloroethylene x not r ecommended chlorothene x not r ecommended acetone x not r ecommended thinner x not r ecommended page : 10 2017.9.29
hftv1108gs - tr this kind of led lamp is highly sensitive to surge voltage generated by the on/off status change and discharges of static electricity through frictions with synthetic materials, which may cause severe damage to the die or undermine its reliability. damaged products may experience conditions such as extremely high reverse voltage, or a decrease of forward rise voltage, deteriorating its optical characteristic. stanley products are designed to withstand up to 1,000v under the eiaj ed - 4701/300 test ? 304 (hbm), and are packed with anti - static components. however, the following precautions and measures are vital in ensuring product quality during shipment. eiaj ed - 4701/300 304/hbm electrification model: c=100pf, r2=1.5k do not place electrified non - conductive materials near the led product. avoid led products from coming into contact with metallic materials.( should the metallic material be electrified , the sudden surge voltage will most likely damage the product .) avoid a working process which may cause the led product to rub against other materials . install ground wires for any equipment, where they can be installed, with measures to avoid static electricity surges . prepare a esd protective area by placing a conductive mattress (1m max.) and ionizer to remove any static electricity. operators should wear a protective wrist - strap. operators should wear conductive work - clothes and shoes. to handle the products directly, stanley recommends the use of ceramic, and not metallic, tweezers. 2. working environment a dry environment is more likely to cause static electricity. although a dry environment is ideal for storage state of led products, stanley recommends an environment with approximately 50% humidity after the soldering process. recommended static electricity level in the working environment is less than 150v , which is the same value as integrated circuits (which are sensitive to static electricity). for electric static discharge ( esd) 1. electrification/static electricity protection stanley recommends the following precautions in order to avoid product (die) damage from static electricity , when an operator and other materials electrified by friction coming in contact with the product. handling precaution page : 11 2017.9.29
hftv1108gs - tr other precautions 1. stanley led lamps have semiconductor characteristics and are designed to ensure high reliability. however, the performance may vary depending on usage conditions 2. absolute maximum ratings are set to prevent led lamps from failing due to excess stress ( temperature , current, voltage, etc .). usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously . 3. in order to ensure high reliability from led lamps, variable factors that arise in actual usage conditions should be taken into account for designing. ( derating of typ., max forward voltage, etc.) 4. please insert straight protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current . 5. please avoid the stick of foreign material because molding resin in the products have adhesiveness. also please don't touch lens portion. 6. please check the actual performance in the assembly because the specification sheets are described for single led. 7. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 8. the products are designed to operate without failure in recommended usage conditions. however, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise . 9. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 10. when there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding). please make sure there is no problem before using . 11. the formal specification sheets shall be valid only by exchange of documents signed by both parties. handling precaution page : 12 2017.9.29
hftv1108gs - tr 1. picking up point with nozzle: lamp housing of the product ( area ) ( shown below) recommendation the picking up point should be within lamp housing portion, because the silicone resin used for the lens is soft. (if the nozzle makes contact with the lens, the products might be destroyed) handling precautions for product mounting please adjust the load, the pick up point, the nozzle diameter, etc. before mounting because the over load can cause breakage of the lamp housing. a b max. 2. recommended nozzle shape nozzle with chamfering is recommended handling precaution load : less than 10n (to avoid the product breakage) page : 13 2017.9.29
hftv1108gs - tr this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is maximum 1 year . if the device needs to be soldered twice, both soldering operations must be completed within the 1year. if any components should remain unused, please reseal the package and store them under the conditions described in the recommended storage condition above . this product must be required to perform baking process (moisture removal) for at 48h( min.). 72 h (max .) at 60 5 degrees celsius if following conditions apply. 1. in the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2 . in the case of time passes for 1year after the package is opened once . baking process should be performed after led having been taken out of the package . baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. avoid storage in corroding and dusty environment time elapsed after package opening products warranty period in the case of the package unopened , 1 year under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition. recommended storage condition temperature +5 30 humidity under 60% packaging specifications page : 14 2017.9.29
hftv1108gs - tr moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a heat sealing position (after product being put in) packaging specifications allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting page : 15 2017.9.29 no. part name material remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
hftv1108gs - tr packing box ( rohs ? elv compliant) the above measure is all the reference value. the box is selected out of the above table by shipping quantity. b type a material / box cardboard c5bf type b,c material / box cardboard k5af partition cardboard k5bf box type outline dimension l w h (mm) capacity of the box type a 280 265 45 3 reel type b 310 235 265 15 reel type c 440 310 265 30 reel packaging specifications page : 16 2017.9.29 no. part name material remarks packing box corrugated cardboard without esd protection
hftv1108gs - tr label specification ( acc.to jis - x0503(code - 39 ) product label a. parts number b . bar - code for parts number c. parts code (in - house identification code for each parts number) d. packed parts quantity e . bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details ) g. bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number bar - code font : acc.to code - 39(jis - x0503 ) b a packaging specifications page : 17 2017.9.29
hftv1108gs - tr (acc.to jis - c0806 - 03 appearance note " - tr" means cathode s ide of leds should be placed on the sprocket - hole side. items specifications remarks leader area cover - tape cover - tape shall be longer than 300mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 13 pieces (100mm). please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 20 pieces (160mm). the end of taping shall be inserted into a slit of the hub. direction to take out taping and reel specifications page : 18 2017.9.29
hftv1108gs - tr ( acc.to jis - c0806 - 03 qty . per reel mechanical strength others 1,000parts/reel minimum qty. per reel might be 100 parts when getting less than 1,000 parts. in such case, parts of 1 00 - unit - qty . shall be packed in a reel and the qty . shall be identified on the label. cover - tape adhesive strength shall be 0.1 1.3n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mixing shall not be held. max. qty. of empty pocket per reel is 1 piece . taping and reel specifications page : 19 2017.9.29
hftv1108gs - tr taping dimensions reel dimensions ( acc.to jis - c0806 - 03 unit mm taping and reel specifications page : 20 2017.9.29 carrier-tape with esd protection cover-tape with esd protection with esd protection carrier-reel no. part name remarks
hftv1108gs - tr lot number notational system - 1digit production location (alphabet ) - 1digit production year (last digit of production year 20200, 20211, 20222, ??? ) - 2digit production month (jan. to sep. , should be 01 , 02, 03 , ????? ) - 2digit production date - 3digit serial number - 2digit tape and reel following number - 2digit luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) - 2digit chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1digit option rank ( stanley normally print " - " to indicate) page : 21 2017.9.29
hftv1108gs - tr this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max correspondence to rohs ? elv instruction page : 22 2017.9.29
hftv1108gs - tr reliability testing result 1. reliability testing result 2. failure criteria ta 30min / cycle fig.1 thermal shock cycle condition 15min 15min 110 - 40 page : 23 2017.9.29 ta=-40 (15min.) 110 (15min.) as shown in the fig.1 below 1,000 cycles 0/18 m oisture soak:jedec level2 preheating:150 180 90 120sec soldering:260 5sec 2times 0/18 thermal shock cycle resistance to reflow soldering eiaj ed-4701 /100(105) eiaj ed-4701 /300(301) ta=85 rh=85% tj=125 1,000hr 0/18 ta=-40 i f =200ma 1,000hr 0/18 test condition duration failure tj=125 i f =200ma 5,500hr 0/18 high temperature operating life low temperature operating life high temperature humidity bias test item standard eiaj ed-4701 /100(101) eiaj ed-4701 /100(101) eiaj ed-4701 /100(102) appearance notable discoloration, deformation and crack forward voltage item luminous intensity symbol conditions acceptance criteria i v i f =140ma ta=25 initial value 0.8 > t esting min. value initial value 1.2 < t esting max. value v f i f =140ma ta=25 measured value < initial value 0.9 measured value > initial value 1.1 reverse current i r v r =12v ta=25 measured value > 25 a
hftv1108gs - tr special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 24 2017.9.29

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